Substitutes for Cerium Oxide in Glass Polishing and CMP
The main alternatives you'll actually see
In polishing and chemical-mechanical polishing (CMP), the most common non-ceria abrasive families discussed are:
Zirconia as a direct "replace ceria" candidate
A practical, industry-oriented route for reducing ceria usage in glass polishing is switching to zirconia abrasives. A conference paper focused specifically on developing alternative abrasives for glass polishing proposed ZrO2 as an alternative to CeO2 to reduce ceria use.
Silica and alumina: common, but performance trade-offs matter
Silica and alumina are widely used abrasives in CMP and polishing, but ceria often wins on the combination of removal rate and finish quality on silica-based surfaces.
For example, one comparative study on polishing performance reported higher removal rate and lower roughness for ceria slurry versus silica and alumina in its tested system.
A separate review of cerium recovery from polishing waste also notes that based on polishing-relevant criteria, ceria can outperform zirconia and alumina in glass polishing contexts.
The realistic outcome in polishing
In many real settings, "substitution" is not a clean swap. It tends to look like:
- switching to another oxide abrasive for certain substrates or finish targets
- changing pad chemistry, slurry chemistry, and process conditions to make non-ceria abrasives viable
- using mixed abrasive systems (for example, ceria plus harder abrasives) when chasing throughput or defect reduction
If your goal is to reduce exposure to ceria supply or price swings, polishing is the application where substitution is most technically feasible, but also the one where performance penalties can show up fast.